CoolbrAIn
Chiplet Cooling Solutions for Low-Consumption Embedded Processing AI at Nanoscale
Our Mission
CoolbrAIn embarks on a pioneering journey to unleash the potential of chiplet architecture for embedded systems and smart devices using artificial intelligence. Our goal is to improve the total efficiency of the system by embedding the chiplets in a diamond heat spreader and by recovering up to 30% of the thermal energy using near field super-Planckian energy harvesting.
Our Partners
CoolbrAIn unites leading European universities, research institutes, and industry partners in a shared mission to make nanoelectronic systems more efficient and sustainable. Through this collaboration, experts in materials science, microelectronics, and energy innovation combine their strengths to transform waste heat into usable energy. Together, the consortium represents the excellence and diversity of European research, driving forward breakthroughs that redefine how technology manages and recycles heat at the nanoscale.
Why CoolbrAIn?
AI chips generate a lot of heat. To keep temperatures under acceptable limits, datacenters usually rely on liquid cooling systems.
Diamond is an electric insulator with a very high thermal conductivity and can help to spread the heat generated locally within the chips over a larger volume, instantly decreasing the operation temperatures and the energy consumption.
New high-performance computing architectures for embedded systems including smart edge devices, cannot rely on liquid cooling. The development of new technologies that improve cooling performance and efficiency has become imperative.
Recycling a portion of the thermal energy generated by the AI chips and converting it back into electrical power could further enable substantial energy savings.
News
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