On 2-3 September 2026, CoolbrAIn participated in the first in-person meeting of the EIC Effitronics portfolio, hosted by CoolbrAIn coordinator Thales at its facilities in Palaiseau, France.
The meeting brought together around 40 representatives from the six EIC Pathfinder projects that make up the Effitronics portfolio: 2D-ADDICT, 2DFERROPLEX, CERBERUS, CoolbrAIn, SPARK-e and SpikeHERO. Together, these projects are exploring complementary technologies towards a common goal: developing more energy-efficient nanoelectronics for future smart edge devices.


During the two-day meeting, the projects presented their respective approaches and explored opportunities for collaboration and technological synergies across the portfolio. Dedicated working-group sessions addressed technical cooperation and joint benchmarking, communication and outreach, energy-efficiency metrics, and intellectual property and exploitation.
CoolbrAIn coordinator Wilson Maia (Thales) presented the project and its approach to improving the energy efficiency of AI chiplets through advanced thermal management and heat-to-electricity conversion.
The meeting also provided an important opportunity for members of the six projects to meet in person, exchange expertise and begin defining a common roadmap for the Effitronics portfolio.
For CoolbrAIn, participation in Effitronics opens new opportunities to connect our work on thermal management with complementary developments in materials, devices and computing architectures across the portfolio – contributing together towards more energy-efficient electronics.